ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,270, issued on Sept. 8, was assigned to Molex LLC (Lisle, Ill.). "Connector assembly" was invented by Che-Yuan Yang (New Taipei City, Taiwa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,271, issued on Sept. 8. "Platform supports the shortest direct electrical connections between two OSFP-XD transceivers" was invented by Shu... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,272, issued on Sept. 8, was assigned to GEMTEK TECHNOLOGY Co. LTD. (Hsinchu, Taiwan). "Communication assembly and heat dissipation shieldin... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,273, issued on Sept. 8, was assigned to Artilux Inc. (Menlo Park, Calif.). "Connector module for optical communication" was invented by Cha... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,274, issued on Sept. 8, was assigned to Gemtek Technology Co. Ltd. (Hsinchu, Taiwan). "Optical fiber connector assembly" was invented by We... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,275, issued on Sept. 8, was assigned to ACOME (Paris). "Optical communication bundle and associated optical cable" was invented by Patrice ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,276, issued on Sept. 8, was assigned to CORNING RESEARCH & DEVELOPMENT Corp. (Corning, N.Y.). "Optical fiber cable with welded armor layer"... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,277, issued on Sept. 8, was assigned to CORNING RESEARCH & DEVELOPMENT Corp. (Corning, N.Y.). "Stranded optical fiber cable" was invented b... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,278, issued on Sept. 8, was assigned to Apple Inc. (Cupertino, Calif.). "Electronic devices with removable light seals" was invented by Eli... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,279, issued on Sept. 8, was assigned to Metalenz Inc. (Boston). "Optical module including metasurface chip and methods of manufacturing the... Read More